Grooves formed around a semiconductor device on a circuit board



FIG. 1 shows a plan view of grooves formed around a semiconductor deviceon a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by thearea boxed by the dot- dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.

The special dot-dash broken line defines the boundary of the claimeddesign; the gray stippling indicates the surface of the groove bed; thebroken lines show unclaimed subject matter forming no part of theclaimed design.

The ornamental design for grooves formed around a semiconductor deviceon a board, as shown and described.